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    Product 8 of 22

    Corsair H55 Hydro Series CPU Water Cooling
    [WC-CH55]

    Quickfind Code: 85401

    Price:  R1,000.00



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    Product Specifications

    Corsair H55 hydro series cpu water cooling - copper , pre-filled / closed-loop / sealed coolant system , 120x152x27mm radiator , Integrated pump and reservoir is sealed for zero maintenance , radiator with 120mm fan , 1700rpm , 57CFM, 30.32dBA, 1.9mm/H2O- for Intel LGA775/ LGA1155/LGA1156/LGA1366/LGA2011 ; AMD FM1/AM2/AM3

    Product Range Features (Actual Product Features May Differ - Zaps)

    The Easy CPU Performance Upgrade

    Your PC will run cooler and quieter when you replace your CPUs standard heatsink with a Hydro Series H55.

    Installation is straightforward: if you can get to the back of your PCs motherboard, you can install an H55. All youll need is a screwdriver.

    Great for Smaller Cases

    The compact components and flexible tubing make Hydro Series H55 easy to install even if youre cramped for space. It allows you to improve your CPUs cooling efficiency even in most compact cases " as long as your case has a 120mm fan mount near the CPU, H55 will probably fit.

    Self-contained cooling system

    Hydro Series H55 comes pre-filled, and never needs refilling or priming.

    Tool-free mounting bracket kit

    The modular design makes installation simpler, and its compatible with Intel and AMD processors.

    Low-noise, low-speed 120mm fan

    The low speed and wide diameter reduces noise levels over the smaller, faster fans used on stock CPU coolers. The three-pin connector is compatible with fan controllers.

    Low permeability rubber tooling

    Minimal coolant evaporation helps ensure long life, and the resilient rubber offers both high flexibility and excellent leak protection.

    Low-profile pump

    The pump unit provides high-speed circulation without taking a lot of space. This makes installation easier, and helps improve your cases airflow.

    Latest generation micro-fin copper cold plate with pre-applied thermal compound

    Copper has excellent thermal transfer characteristics, and the fin design is optimized for efficient heat exchange.

    Low-profile black aluminum heat exchanger

    The low-profile design reduces the airflow requirement, which helps make H55 quieter. The small size also allows for easier installation and improved compatibility, and the black finish looks great.

    Product Range Specifications (Actual Product Specifications May Differ - Zaps)

    Technical Specifications

    * Radiator dimensions: 120mm x 152mm x 27mm
    * Fan dimensions: 120mm x 120mm x 25mm
    * Fan speed: 1700RPM +/- 10%
    * Fan airflow: 57 CFM
    * Fan dBA: 30.32 dBA
    * Fan static pressure: 1.9mm/H20

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